As a modern PMIC, the VPM2SM likely incorporates several key features common to Silicon Mitus's design philosophy, including:
The VPM2SM’s side-looking package is uniquely suited for optical interrupters, edge-detection sensors, and compact transmissive systems.
| Manufacturer | Part Number | Difference | |--------------|-------------|-------------| | Littelfuse | SMBJ2.0A | Uni-directional | | Littelfuse | SMBJ2.0CA | Bi-directional | | Vishay | SMBJ2.0A-E3 | - | | ON Semi | SZ1SMB2.0AT3G | Automotive grade | | Bourns | SMBJ2.0A | - | | Diodes Inc. | SMBJ2.0A-13-F | - |
The high junction capacitance (≈1200pF) makes the VPM2SM unsuitable for high-speed data lines (e.g., USB 2.0, Ethernet). Use low-capacitance TVS arrays for those applications. vpm2sm datasheet
16 pins (standard QFN) or 56 pins depending on the specific application/variant. Functional Features
: It discusses how silicon is reaching its physical limits and how 2D materials (like MoS2 ) can sustain Moore's Law.
This section is directly extracted and interpreted from the typical values. Always verify with the specific manufacturer’s datasheet for your batch. As a modern PMIC, the VPM2SM likely incorporates
The "SM" designation typically refers to the "SMD" (Surface Mount Device) or "Single Module" form factor optimized for automated assembly or specific thermal configurations. These modules are often utilized as front-end converters in distributed power architectures (DPA), taking a high-voltage bus and creating an intermediate bus voltage (IBV) for downstream point-of-load (POL) converters.
: A cluster of ceramic bypass capacitors (typically labeled C1 through C6) must be placed next to the input rails to filter out high-frequency ripple.
VPM2SM SILICONMITUS Интегральные схемы (ИС) Use low-capacitance TVS arrays for those applications
In modern display modules, the VPM2SM PMIC works alongside the main System on Chip (SoC) and the T-Con processing unit. While the SoC handles data processing, the VPM2SM focuses entirely on generating precise power planes:
This technical analysis covers the data sheet parameters, structural design, application workflows, and sourcing guidelines for the chipset. 1. Core Technical Specifications Go to product viewer dialog for this item.