The latest revision, which expanded the scope to include non-printed boards (like metal boards) and updated copper thickness limits for plated holes. Key Components & Requirements
Assembly processes using press-in tools (manual or automated).
Modified the upper limit of copper thickness for plated-through holes to align with modern manufacturing trends. iec 603525 pdf
The hole must have the correct diameter (
I notice you’re looking for information on — but this appears to be a typo or a misremembered standard number. There is no IEC 603525 in the official IEC catalog (IEC standards follow the format IEC 60xxx or IEC 61xxx, with typically 3–5 digits after the 60 or 61 prefix). The latest revision, which expanded the scope to
: Specifies the nominal diameter, copper thickness (typically a minimum of 25 µm), and total finished hole tolerance. 2. Qualification and Testing Schedules
The standard, titled "Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance," is the definitive international document governing press-fit technology in electronics. It establishes the mechanical, electrical, and environmental criteria necessary to ensure reliable, solderless joints between connector pins and board holes. Overview of the Latest Edition (2020) The hole must have the correct diameter (
The International Electrotechnical Commission (IEC) has published a series of standards for solderless connections, which are used in various electrical and electronic applications. One of these standards is IEC 60352-5, which specifically deals with solderless press-in connections.
Matching pin geometry with hole diameters.
The standard ensures that compliance leads to mechanically stable and electrically optimal interfaces between a press-fit pin and a plated-through hole (PTH) in a PCB. Key Focus Areas of the Standard
Ensuring adequate retention force without damaging components.